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Add USB-C mid-mount 16-pin footprinter#708

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seveibar wants to merge 3 commits into
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agent/add-usbcmidmount16-footprint
Draft

Add USB-C mid-mount 16-pin footprinter#708
seveibar wants to merge 3 commits into
mainfrom
agent/add-usbcmidmount16-footprint

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@seveibar

@seveibar seveibar commented Jul 13, 2026

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Summary

  • add a parametric usbcmidmount16 footprinter for both merged 12-land and split 16-land USB-C receptacles
  • parameterize contact-row position/dimensions, power pads, shell-tab span/slots/rings, locator holes, body depth, and pin direction
  • validate five real JLCPCB EasyEDA footprints with measured copper IoU and committed SVG snapshots

Why

The TYPE_C_16PIN_2MD_073_ footprint imported in common#78 combines unequal-width signal pads, plated shell slots, and non-plated locator holes. Other common JLCPCB USB-C receptacles vary materially: some expose all 16 contacts, some merge duplicate contacts into 12 lands, some omit locator holes, and shell-tab geometry differs by board-sink depth.

Covered JLCPCB parts

The target copper primitives were imported from JLCPCB/EasyEDA using tsci import --jlcpcb <part number>.

  • C2765186, TYPE-C 16PIN 2MD(073), 12 lands: 99.99% copper IoU
    • usbcmidmount16_pinstart13
  • C2906289, TYPE-C 16P CB0.8 073, 12 lands: 99.99% copper IoU
    • usbcmidmount16_noholes_powerx3.21mm_powerpw0.6mm_rowy2.386mm_ph1mm_shellx5.6mm_topy1.164mm_bottomy2.836mm_tophh1.4mm_topring0.3mm_bottomhh1.8mm_bodybottom4.876mm
  • C2906290, TYPE-C 16P CB1.6 073, 16 lands: 100.00% copper IoU
    • usbcmidmount16_split_reverse_noholes_pinstart25_rowy2.325mm_shellx5.62mm_topy1.175mm_bottomy2.825mm_tophh1.3mm_topring0.2mm_bottomhh1.7mm_bottomring0.2mm_bodybottom4.925mm
  • C709357, KH-TYPE-C-16P, 16 lands: 100.00% copper IoU
    • usbcmidmount16_split_pinstart1_rowy2.115mm_ph1.3mm_shellx4.32mm_topy1.465mm_bottomy2.715mm_tophh1.6mm_topring0.2mm_bottomhh1.4mm_bottomring0.2mm_holey0.935mm_bodybottom5.38mm
  • C319148, U262-161N-4BVC11, 12 lands: 100.00% copper IoU
    • usbcmidmount16_reverse_pinstart13_rowy2.161mm_ph1.3mm_powerpw0.6mm_shellx4.32mm_topy1.419mm_bottomy2.761mm_tophw0.7mm_tophh1.7mm_topring0.25mm_bottomhw0.7mm_bottomhh1.3mm_bottomring0.25mm_holey0.919mm_bodybottom5.4mm

Impact

Imported mid-mount USB-C footprints can now be represented by reusable physical parameters instead of inline TSX copper. Locator holes remain mechanical holes rather than zero-annulus plated copper.

Validation

  • bun test tests/usbcmidmount.test.ts — 6 pass, 0 fail; all five copper IoUs above 99.99%
  • five visually inspected SVG snapshots
  • bun test — 439 pass, 0 fail
  • bun run build
  • git diff --check

@seveibar
seveibar requested a review from Abse2001 July 19, 2026 14:14
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